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Cooled Near-Infrared Linear Image Sensor with 512X1 Pixels

Product Description: 

Precision Micro-Optics offers cooled near-infrared linear image sensor consisting of a linear InGaAs-detector array bonded to the p-on-n readout IC.

 

 

Product Features:

  • 512X1 Pixels (25X250um or 25X500um)
  • 28-pin Metal DIP Package
  • Embedded Thermoelectric Cooler
  • Built-in Temperature Sensor
  • 0.9 μm – 1.7 μm Spectral Range
  • Minimum Pixel Operability > 99%
  • Quantum Efficiency > 70%
  • Snapshot ITR / IWR
  • 2 Outputs with up to 22 MHz Pixel Rate

Applications:

  • Shortwave-Infrared Imaging
  • Semiconductor Inspection / Process Monitoring
  • Near-Infrared Spectrophotometr

SPECIFICATIONS (ITS = 20 ± 1ºC)(Readings from Integrated Temperature Sensor (ITS)):

Parameters
Symbol
Test conditions
Min
Typ Max
Unit
Sensor Technology
    Planar InGaAs PIN

Actual Pixel Array
    512 x 1

Pixel Pitch
    25
um
Pixel Size (S)
    25 X250
um
Pixel Size (M)
    25 X500
um
Spectral Response Range
λ
  900
  1700
nm
Dark Current (S)(*)
ID
VR = 0.5V
 
0.6
nA
Dark Current (M)(*)
ID
VR = 0.5V
 
1
nA
Quantum Efficiency * Fill Factor(*)
QEFF
λ = 1550nm
70

%
Response Nonuniformity(*)

At 50 % Full Well

5
%
Response Nonlinearity

15 % – 85 % Well Occupation Range

2
%
Charge Capacity
(16 settings)


Cint = 6.4 fF

25
  μV/e-
Cint = 16 fF

10
 
Cint = 30 fF

5.3
 
Cint = 120 fF

1.3
 
Cint = 2.1 pF

0.076
 
Readout Noise
(ROIC Specifications )


Cint = 6.4 fF

1.2
  mV
Cint = 16 fF

0.8
 
Cint = 30 fF

0.6
 
Cint = 120 fF

0.5
 
Cint = 2.1 pF

0.25
 
Output Swing

Gain @ 120 fF
2.0

V
Minimum Integration Period

 ROIC Specifications  5

μs
Maximum Pixel Rate

 ROIC Specifications  
22
MHz
Pixel Operability(*)
VBD
Percentage of Pixels with QEFF
Deviation ± 20%*(QEFF Mean)
99
  %
Chip Size
    15.3 x 4.5
mm
Package Type
    28-pin Metal DIP Package

Package Size L x W x T
    50.00 x 25.40 x 11.67
mm
Weight
    25.8
g

Note (*): These items are defined for central effective pixel array (512x1). Their values correspond to default operation conditions.

 

Absolute Maximum Ratings (T=25ºC):

  Parameters
Min
Typ Max
Unit
  Operating Temperature
-40
  70
°C
  Storage Temperature
-40
  70
°C
  Power Consumption
    95
mW

 

Package Dimensions (mm) and Pin Definition:

  01
VDD
08
SDOUT 15
GND
22
NC
  02
RESET
09
DATVALID 16
NC
23
NC
  03
TEC+
10
VOUT 17
VOFFSET
24
NC
  04
INT
11
VDDA 18
VTEMP
25
NC
  05
MC
12
VR2 19
NC
26
TEC-
  06
CEB
13
VR1 20
NC
27
NC
  07
SDIN
14
VDETCOM 21
NC
28
NC

CHIP LAYOUT:

 

SPI Interface:

The Linear Image Sensor supports SPI protocol to set the command registers. There are functions of the gain mode, power consumption control and the sequence of pixel output.

 

Bias Input :

  Pin #
Bias
Voltage Current
Remark
  01
VDD
1.8 V > 30 mA
Positive logic supply
  11
VDDA
3.6 V > 60 mA
Positive analog supply
  12
VR2
0.3 V > 30 mA
External Input Bias
  13
VR1
2.3 V > 5 mA
External Input Bias
  14
VDETCOM
> VR1
Detector common voltage
Detector bias = VDETCOM - VR1 (*)
  15
GND
0V
Ground
  03
TEC+
0 V ~ 5.3 V < 2.2 A
Positive TEC supply
  26
TEC-
0 V
TEC ground
  02
RESET
1.8 V
Chip reset
  17
VOFFSET
0.3 ~ 2.3 V > 30 mA
Offset Input Bias

Note (*): VDETCOM lower than 2.3 V will forward bias the sensor, the exact zero bias voltage is device and temperature dependent.

Digital Pattern Input :

  Pin #
Clocks
Levels Rise/Fall
Remark
  04
INT
1.8 V / 0 V < 50 nS
Integration time
  05
MC
1.8 V / 0 V < 5 nS
Master clock, Max. Freq. = 22 MHz
  06, 23
CEB
1.8 V / 0 V < 10 nS
Chip enable(*)
  07
SDIN
1.8 V / 0 V < 5 nS
Data code input

Note (*): The input and output of all commands start after the falling edge of CEB.

Digital Pattern Output :

  Pin #
Clocks
Levels Rise/Fall
Remark
  08
SDOUT
1.8 V / 0 V
Data code output
  09
DATVALID
1.8 V / 0 V
Valid data output flag signal

Analog Output :

  Pin #
Outputs
Levels Value
Remark
  10
VOUT
0.2 ~ 2.4 V
Video output
  18
VTEMP
2.138 V 27℃
Integrated Temperature Sensor (-0.6 mV /℃)

Figures :

Copyright © 2016 Precision Micro-Optics Inc. All Rights Reserved.